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Module Packaging Engineer Thermal Process Innovation Jobs in Kulim
AI opportunities in Malaysia
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Module Packaging Engineer – Thermal & Process Innovation
🏢 Intel
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Packaging Module Development Engineer
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Onsite Packaging Module Engineer – Lid & Stiffener
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Direct Lid/Stiffener Attach Packaging Module Development Engineer
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Direct Lid/Stiffener Attach Packaging Module Development Engineer
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Senior SMT Packaging & PCB Module Engineer
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Packaging Module Development Engineer
🏢 Intel
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Assembly Laser Development Engineer
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Mechanical Design Engineer: Prototyping & Thermal Systems
🏢 Watlow
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Module Equipment Technician (Contract)
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
🏢 Intel
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Assembly Laser Development Engineer
🏢 Intel
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
CUF TD Module Engineer
🏢 Intel
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Senior Engineer Module Planning
🏢 Infineon Technologies
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Packaging Module Engineer — Direct Lid & Stiffener (Onsite)
🏢 Intel
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Yield Analytics Engineer
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
IT-&-Technology
View Opening Details
Yield Analytics Engineer
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
IT-&-Technology
View Opening Details
Die Attach & Thermal Bonding Process Engineer On-Site Kulim
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Process and Equipment Engineer
🏢 Intel
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Direct Lid/Stiffener Attach Packaging Module Development Engineer
🏢 Intel
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Advanced Laser Packaging Process Engineer
🏢 Intel
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Assembly and Test NPI Integrator
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
Full-time
IT-&-Technology
View Opening Details
Senior Engineer Module Planning
🏢 Infineon Technologies (Kulim) Sdn Bhd
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Packaging Process Engineer - NPI & Tech Development
🏢 Intel
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
EMS Production Lead - Kulim, Kedah (Growth & Impact)
🏢 Watlow
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Senior Process Engineer: Materials & Latex Innovation
🏢 Becton Dickinson
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
Senior Staff Engineer Technology Development
🏢 Infineon Technologies
📍 Kulim, Kedah, Malaysia
Full-time
IT-&-Technology
View Opening Details
Assembly and Test NPI Integrator
🏢 Intel
📍 Kulim, Kedah, Malaysia
Full-time
IT-&-Technology
View Opening Details
Principal Engineer Process Development
🏢 Infineon Technologies
📍 Kulim, Kedah, Malaysia
Full-time
Engineering
View Opening Details
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