Jobs Found

CUF TD Module Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Assembly Laser Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Senior SMT Packaging & PCB Module Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Die Attach & Thermal Bonding Process Engineer On-Site Kulim

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Onsite Packaging Module Engineer – Lid & Stiffener

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Technology Development Engineer (Solder Resist/Solder Mask, Lamination, Gold/Electroless Plating)

🏢 Austria Technologie & Systemtechnik AG 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Packaging Module Development Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Senior Engineer Module Planning

🏢 Infineon Technologies 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Packaging Module Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Senior Engineer Module Planning

🏢 Infineon Technologies (Kulim) Sdn Bhd 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Assembly Laser Development Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Module Packaging Engineer – Thermal & Process Innovation

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Lab technician (Tool and support)

🏢 NCS Solutions 📍 Kulim, Kedah, Malaysia
Full-time Bio-&-Pharmacology-&-Health

Packaging Module Engineer — Direct Lid & Stiffener (Onsite)

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Senior Module Planning Engineer - Ramp Readiness & Capacity

🏢 Infineon Technologies 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Module Equipment Technician (Contract)

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Module Equipment Technician (Contract)

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Direct Lid/Stiffener Attach Packaging Module Development Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Direct Lid/Stiffener Attach Packaging Module Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering