Jobs Found

PCB Packaging Technician: Process & Equipment Specialist

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Packaging Module Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Service Technician/Engineer

🏢 SCHMID ASIA PACIFIC SDN 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Packaging Module Development Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Packaging Module Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Packaging Module Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Packaging Module Development Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Module Equipment Technician (Contract)

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Package Engineering Technician

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Package Engineering Technician

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Service Technician/Engineer

🏢 Gebr. Schmid 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Technician (Process/Equipment)

🏢 AlphaESS Malaysia 📍 Kulim, Kedah, Malaysia
Full-time Engineering

PCB Packaging Technician: Build, Inspect & Optimize

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

PCB Packaging Technician: Build, Inspect & Optimize

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Package Engineering Technician

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Package Engineering Technician

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Package Engineering Technician

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Package Engineering Technician

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Package Engineering Technician

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Package Engineering Technician

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Direct Lid/Stiffener Attach Packaging Module Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Direct Lid/Stiffener Attach Packaging Module Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

MSAP Engineer, PCB

🏢 Ichia Technologies, INC. 📍 Kulim, Kedah, Malaysia
Full-time Engineering

CUF TD Module Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

CUF TD Module Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Other-General

CUF TD Module Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Other-General

CUF TD Module Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Direct Lid/Stiffener Attach Packaging Module Development Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Direct Lid/Stiffener Attach Packaging Module Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Other-General

Direct Lid/Stiffener Attach Packaging Module Development Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Other-General