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Packaging Process Module Lead Advanced Die Attach Materials Jobs in Batu Kawan
AI opportunities in Malaysia
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Packaging Process Module Lead — Advanced Die Attach & Materials
🏢 Sandisk
📍 Batu Kawan, Penang, Malaysia
Full-time
Engineering
View Opening Details
Manager, Process Module Engineering (Packaging Engineering)
🏢 Sandisk
📍 Batu Kawan, Penang, Malaysia
Full-time
Engineering
View Opening Details
Manager, Process Module Engineering (Packaging Engineering)
🏢 SanDisk
📍 Batu Kawan, Malaysia, Malaysia
Full-time
other-general
View Opening Details
Senior Engineer, Packaging Engineering
🏢 SANDISK
📍 Batu Kawan, Penang, Malaysia
Full-time
Engineering
View Opening Details
Senior Engineer, Packaging Engineering
🏢 SanDisk
📍 Batu Kawan, Malaysia, Malaysia
Full-time
other-general
View Opening Details
Principal Engineer, Product Development Engineering - Module
🏢 Sandisk
📍 Batu Kawan, Penang, Malaysia
Full-time
Engineering
View Opening Details
Technician 3, Manufacturing Equipment
🏢 SanDisk
📍 Batu Kawan, Malaysia, Malaysia
Full-time
other-general
View Opening Details
Technician 3, Manufacturing Equipment
🏢 Sandisk
📍 Batu Kawan, Penang, Malaysia
Full-time
Engineering
View Opening Details
Staff Engineer, Packaging Engineering (Mechanical Development)
🏢 Sandisk
📍 Batu Kawan, Penang, Malaysia
full-time
Engineers
View Opening Details
Staff Engineer, Packaging Engineering (Mechanical Development)
🏢 SanDisk
📍 Batu Kawan, Malaysia, Malaysia
Full-time
other-general
View Opening Details
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