芯片贴装工艺工程师/Die Attach Process Engineer

**岗位职责：**
1. 负责半导体封装Die Attach（固晶/芯片贴装）工序量产工艺管控、参数调试与制程优化；
2. 主导固晶工序良率提升、制程异常分析、不良根因定位及闭环改善；
3. 编制、修订固晶工序工艺规范、作业指导书（SOP）、 FMEA、制程管控文件；
4. 负责新产品NPI导入、物料适配验证、固晶胶/芯片基材工艺适配测试；
5. 对接设备、品质、生产部门，解决量产端固晶偏移、虚焊、掉晶、气泡等工艺类不良问题。

**Why TI?**

+ Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
+ We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012)
+ Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here (https://careers.ti.com/en/sites/...