Job Description
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Over 5 years in wire bonding and semiconductor packaging.
Supervisory experience in managing technical staffs to deliver technical projects.
Language Proficiency: English and Malay. Mandarin and Japanese are added advantages.
Good Analytical and problem‑solving skills.
Good communication skills and strong interpersonal skills.
Education: Degree of Engineering in Materials, Electronics, Mechanical, or other related field.
Job Responsibilities
Provide technical support to customers, troubleshoot and resolve issues, and deliver effective solutions for the application of bonding wire products.
Interact with customers to understand their technical requirements, analyzing and resolving product performance issues, and supporting the implementation of bonding wire solutions at customer sites.
Collaboration with internal stakeholders to enhance product development and e...
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