Job Description

Qualifications

  • Over 5 years in wire bonding and semiconductor packaging.
  • Supervisory experience in managing technical staff to deliver technical projects.
  • Language Proficiency: English and Malay. Mandarin and Japanese are additional advantages.
  • Good analytical and problem‑solving skills.
  • Good communication skills and strong interpersonal skills.
  • Education: Degree of Engineering in Materials, Electronics, Mechanical, or other related field.

Job Responsibilities

  • Provide technical support to customers, troubleshoot and resolve issues, and deliver effective solutions for the application of bonding wire products.
  • Interact with customers to understand their technical requirements, analyze and resolve product performance issues, and support the implementation of bonding wire solutions at customer sites.
  • Collaborate with internal stakeholders to enhance product developmen...

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