Job Description
Responsibilities:
- Lead system integration, setup, calibration, and verification prior to handover to application teams.
- Provide technical leadership and support to production sites, resolving technical and quality issues with cross-functional teams.
- Conduct engineering verification testing for both new and existing modules to meet business requirements.
- Optimize Die Bonder systems to enhance accuracy, stability, and productivity.
- Support the development and qualification of hardware and software modules for semiconductor Die Bonder equipment.
- Plan and analyze experiments to optimize system parameters and production processes for continuous improvement.
- Deliver technical support to internal stakeholders and customers, including support for customer projects and manufacturing issues.
- Document, present, and transfer technical knowledge from engineering to production teams.
Requirements:
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