Staff Process Engineer ( Dicing/ Grinding/ LLO/ Bonding)

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

• To sustain and optimize dicing/ grinding/ LLO/ Bonding process & equipment for continue improvement, countermeasures issue, ensuring tool maximum productivity, new product qualification & release.
• To perform risk assessment using FMEA and derive control when needed. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to quality standard & customer requirement
• Interaction with Equipment engineer to understand the Process & Equipment capability that influence towards the processes. To work with Product Integration Engineer/FPD/NPI to understand the product integration and process
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