Job Description
Job Description
Responsible for improving/developing existing assembly processes & materials working with OSATs across Asia to achieve target yield & quality and zero out customer returns/complaints. Primarily Wirebond, Die Bond & Mold processes.
Responsible for Developing new assembly technologies such as:
Hybrid Wire Bonding (Al Heavy & Fine Wire Ultrasonic Bonding combined with Cu/PCC & Au Heavy Wire Bonding), Ribbon Bonding.
Stacked Dice & Bridged Die Bonding on Leadframe Pad and DBC, Clip Bonding
High CTI, high Thermal, Low Stress Vacuum assisted Molding Technologies
Responsible for defining package design rules, process flow and material set for new products including automotive power module packages
Drive alignment between GaN Power Discrete design requirements and supplier capabilities, to enable new product development and volume manufacturing of GaN Power Discrete products
Run process DOE's to define optimum process windows and material characteristics...
Responsible for improving/developing existing assembly processes & materials working with OSATs across Asia to achieve target yield & quality and zero out customer returns/complaints. Primarily Wirebond, Die Bond & Mold processes.
Responsible for Developing new assembly technologies such as:
Hybrid Wire Bonding (Al Heavy & Fine Wire Ultrasonic Bonding combined with Cu/PCC & Au Heavy Wire Bonding), Ribbon Bonding.
Stacked Dice & Bridged Die Bonding on Leadframe Pad and DBC, Clip Bonding
High CTI, high Thermal, Low Stress Vacuum assisted Molding Technologies
Responsible for defining package design rules, process flow and material set for new products including automotive power module packages
Drive alignment between GaN Power Discrete design requirements and supplier capabilities, to enable new product development and volume manufacturing of GaN Power Discrete products
Run process DOE's to define optimum process windows and material characteristics...
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