Job Description
Company:
Qualcomm India Private Limited
Job Area:
Engineering Group, Engineering Group > Hardware Engineering
General Summary:
We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC packaging development and new product introduction of leading-edge package technologies for AI, Mobile, Bluetooth, WiFi, IoT, Power Management, Connectivity Automotive and new emerging markets and driving that innovation into high volume manufacturing in assembly suppliers. Extensive knowledge and experience in Flip Chip, Wire bond and System in Package assembly process, materials, and equipment are required. The position also requires the ability to lead multi-functional teams and solve complex technical problems in working with multiple OSATs. Experience or worked on projects with Wafer-on-Wafer bonding is a plu...
Qualcomm India Private Limited
Job Area:
Engineering Group, Engineering Group > Hardware Engineering
General Summary:
We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC packaging development and new product introduction of leading-edge package technologies for AI, Mobile, Bluetooth, WiFi, IoT, Power Management, Connectivity Automotive and new emerging markets and driving that innovation into high volume manufacturing in assembly suppliers. Extensive knowledge and experience in Flip Chip, Wire bond and System in Package assembly process, materials, and equipment are required. The position also requires the ability to lead multi-functional teams and solve complex technical problems in working with multiple OSATs. Experience or worked on projects with Wafer-on-Wafer bonding is a plu...
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