Job Description
Job Description
Job Summary:
onsemi is currently seeking an experienced Process Engineer to work on product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots for ultrasonic wirebond and IVI processes for all the product groups. Lead investigation on issues / EFAR cases related to ultrasonic wire bonding process under NPI category and lead WB technology and material roadmap.
Competencies
Leading WB Set-up fo New Product Introductions
Knowledge on Orthodyne and KNS/Power fusion wirebond platforms with deep understanding on the parameters, materials and tools.
Establishing process windows using DOE and pareto analysis
Ability to improve Cpk/Cp and DPMO for WB parameters
Root‑cause analysis of bond lifts, non‑sticks, wire breaks, cratering
Correlation of WB defects to substrate, leadframe, die, and mold compound interactions.
Driving safe‑launch strategies and containment plans
Coordinating WB readiness du...
Job Summary:
onsemi is currently seeking an experienced Process Engineer to work on product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots for ultrasonic wirebond and IVI processes for all the product groups. Lead investigation on issues / EFAR cases related to ultrasonic wire bonding process under NPI category and lead WB technology and material roadmap.
Competencies
Leading WB Set-up fo New Product Introductions
Knowledge on Orthodyne and KNS/Power fusion wirebond platforms with deep understanding on the parameters, materials and tools.
Establishing process windows using DOE and pareto analysis
Ability to improve Cpk/Cp and DPMO for WB parameters
Root‑cause analysis of bond lifts, non‑sticks, wire breaks, cratering
Correlation of WB defects to substrate, leadframe, die, and mold compound interactions.
Driving safe‑launch strategies and containment plans
Coordinating WB readiness du...
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