Sr Staff Package Design Engineer

Company Description

Job Summary

• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus.

• Package technologies qualification for consumer & industrial power as well as automotive power applications.

Job Description

Key Responsibilities

• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).

• Work with OSAT/CM to develop, run DOE to optimize processes, establish process spec & monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer.

• Work with Product groups and Reliability team, qualify new packages and processes within required time frame & further address internal and external customer complains ...