Job Description
We Are:
At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.
You Are:
You are a seasoned hardware engineering professional with a passion for advanced silicon package design and a proven track record in delivering innovative solutions for complex semiconductor challenges. With more than a decade of hands-on experience in package and interposer design, you possess a deep understanding of the latest advancements in 3DIC and multi-physics analysis. Your expertise spans across multiple advanced packaging technologies, and you are enthusiastic about pushing the boundaries of what’s possible in high-performance, energy...
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Take the next step in your AI career. Submit your application to Synopsys, Inc. today.
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