Job Description
The candidate will be part of the data centre group at Media Tek. In this role, the designer will be working with the package and board design teams to design thermal solutions required for board level designs taking into account thermal, structural and electrical considerations. The candidate will also design sockets as required for test vehicles and validation boards. They will perform structural simulation studies to understand the impact of warpage on packages and work across engineering teams to come up with solutions for the same.
Preferred candidate will have a Bachelors/ Master’s degree in Mechanical Engineering with 10 – 12 years of relevant experience.
Experience in performing structural simulations for motherboards/ packages
Previous experience in package socket design
Experience in mechanical design and CAE modelling
Good understanding of different manufacturing techniques and experience in GD&T for various manufacturing processes
Experienced user of simul...
Preferred candidate will have a Bachelors/ Master’s degree in Mechanical Engineering with 10 – 12 years of relevant experience.
Experience in performing structural simulations for motherboards/ packages
Previous experience in package socket design
Experience in mechanical design and CAE modelling
Good understanding of different manufacturing techniques and experience in GD&T for various manufacturing processes
Experienced user of simul...
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