Job Description
Job Purpose:
The Senior Packaging NPI Staff Engineer is responsible for leading Wafer-Level Chip-Scale Package (WLCSP) new product introduction activities from development through volume production. This role serves as the primary technical and program interface to customers, while coordinating crossfunctional global teams to ensure successful execution of schedule, cost, quality, reliability, and cost objectives.
The position requires deep WLCSP technical expertise, strong customer-facing communication skills, and demonstrated experience in board-level reliability evaluation and failure analysis to support customer qualification and risk assessment.
Principal Accountabilities:
- NPI, Reliability & Technical Leadership
o Own WLCSP package and process readiness from development through mass production.
o Define and control assembly flow, critical process parameters, materials, and reliability risks.
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