Job Description

Infineon Technologies seeks a seasoned engineer to lead DFMEA processes and risk analyses within the package technology domain. You will collaborate across FE/BE interfaces, integrate BOM/process data, and guide pre-development for next-gen chip tech.

The role rewards strong communication and problem-solving skills, with emphasis on reliability and cross-functional teamwork in a semiconductor environment.

#J-18808-Ljbffr

Ready to Apply?

Take the next step in your AI career. Submit your application to Infineon Technologies today.

Submit Application