Job Description

We are seeking a highly motivated and experienced semiconductor Senior Module Engineer to join our growing 300mm Post Fab team in East Fishkill, NY. This role is critical to our ability to improve device performance and drive best in class trench MOSFET Technology as we develop new products and ramp volume manufacturing. Job role requires an Engineer who is ready to step in as a leader withing the Team and who has experience in wafer thinning, ultra-thin wafer handling, backside metallization, and managing stress and thermal effects on thinned wafers.

Responsibilities:

  • Owns the process roadmap and module technology direction in EFK’s BGBM Post Fab.
  • Sets process standards across tools and areas of our line as go-to expert with site-level authority to improve our manufacturability of our MOSFET and IGBT technologies in our Post Fab back-grind, back-metallization line. 
  • Owner of control plans, PFMEA and risk mitigation plans for thin wafers...

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