Job Description

Our Newport based client is currently searching for a Senior Packaging Process Engineer to work within a challenging R&D environment to explore and develop disruptive semiconductor packaging and integration technologies. The role will involve leading a team of engineers to develop new microelectronic devices with novel new packaging concepts including assembly, wire-bonding and die bonding. Prototype development will be an important part of the role.

Required skills for the Senior Packaging Process Engineer will include:
  • Strong semiconductor packaging and assembly experience
  • Semiconductor device knowledge
  • Strong communication and leadership skills
  • Degree qualified in Physics, Electronics, Engineering or equivalent
    • Please contact Rachel Anderson for further details.

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