Job Description
Provide technical leadership in new package and product development initiatives, ensuring innovation and alignment with organizational goals. Lead design and development of packaging and process solutions for advanced semiconductor devices, including Si, SiC, JFET, and GaN technologies. Research and select materials to optimize packaging performance and reliability, in collaboration with the Central Material Development (CMD) team. Collaborate and coordinate with cross-functional teams and manage stakeholders to drive successful execution of new package and product development projects. Strong background and hands-on experience in power discrete packaging technologies, including Si, SiC, and GaN. Proven leadership skills and ability to work effectively in a team environment. Excellent analytical and problem-solving abilities, with proficiency in project management, documentation, and reporting. <...
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