Senior IC Package & High-Speed PCB Engineer

UST Malaysia is seeking a PCB design engineer to execute high-density package layouts for CPUs, chipsets and SoC designs. The role emphasizes DRC checks, fix of unconnected pins and dangling vias, and design cleanup using PLA tools where available.

You will handle full package design, interfaces, and power assignments in line with schematics. Ideal candidates have 2+ years in the field, strong knowledge of high-speed signaling, impedance control, and experience with Mentor Graphics Xpedition VX.