Job Description
Your Role
Key responsibilities in your new role
- Perform Discrete/IC Devices Failure Analysis (FA) on Package & Die level from electrical verification, fault isolation and physical root cause analysis.
- Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
- Participate and present FA results in cross functional meetings.
- Interface with designers, test, product, process integration and unit process engineers, problem solving team, CQM team to understand the analysis requirement.
- Responsible for achieving KPIs.
- Setup of application board, product specific test methodology and localization capability.
- CAD navigation, layout and schematic analysis to identify the failure location and hypothesis
- Responsible for Fault Tree Analysis (FTA) in case of no physical defect found
Your Profile
Qualifications And Skills To Help You Succeed
Academic qualifi...
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