Job Description

Your Role

  • Perform Discrete/IC Devices Failure Analysis (FA) on Package & Die level from electrical verification, fault isolation and physical root cause analysis.
  • Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
  • Participate and present FA results in cross functional meetings.
  • Interface with designers, test, product, process integration and unit process engineers, problem solving team, CQM team to understand the analysis requirement.
  • Responsible for achieving KPIs.
  • Setup of application board, product specific test methodology and localization capability.
  • CAD navigation, layout and schematic analysis to identify the failure location and hypothesis.
  • Responsible for Fault Tree Analysis (FTA) in case of no physical defect found.

Your Profile

  • Academic qualification:
    • Degree / Master / PhD in Electrical an...

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