Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Senior Engineer, APTD CEM – Advanced Packaging Die Level Technology Engineering

Senior Engineer – APTD CEM is responsible for developing and enabling the deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability, and schedule requirements. The role collaborates with cross‑functional teams to coordinate technology development and integration flows across the organization.

Key Responsibilities

Process Development

• Develop and optimize assembly processes for advanced packaging technologies, including wafer‑level packaging and die stacking such as Chip‑on‑Wafer and Chip‑to‑Wafer.
• Improve product quality, drive yield improvements, reduce costs, and enhance productivity.
• Establish and improve process‑management projects to deliver technology node requirements.

Equipment and Materials

• Evaluate and promote new equipment and mate...