Job Description

Nexperia in Seremban, Malaysia, is seeking a Process & Equipment Engineer to drive improvements in semiconductor manufacturing. You'll work with advanced equipment and lead projects that enhance yield and quality from day one.

The ideal candidate holds a Bachelor’s degree and has 2-3 years of experience in backend manufacturing, particularly with Die Bond and Wire Bond processes. Strong analytical skills and a proactive mindset are essential, as well as hands-on experience with troubleshooting and process optimization.

Join us to collaborate with experts and thrive in a fast-paced environment!

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