Job Description

A leading semiconductor solutions provider is looking for fresh graduates in Engineering to support the development and optimization of die bond and wire bond processes in Penang, Malaysia. Key responsibilities include troubleshooting issues, participating in new product introductions, and continuous improvement initiatives. Ideal candidates should have a strong willingness to learn, good problem-solving skills, and knowledge of programming in C, C++, or Python. The role offers a hybrid work model, allowing for work flexibility while ensuring collaborative team efforts.
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