Job Description

Roles: Manufacturing Lead- OSAT Packaging & Test

Experience: 5-15 Yrs

Location: Jagiroad, Assam.


Education Qualification: Bachelor’s or Master’s degree in Electronics, Mechanical, Manufacturing Engineering.


Job Description

  • Experienced in manufacturing operations for wire bond, flip chip, and integrated system packaging and Testing of High Volume OSAT Semiconductor Manufacturing.
  • To Planning & execution of the Targeted manufacturing Volumes.
  • Ensure process stability, yield optimization, and cycle time reduction across packaging and test lines
  • Manage daily OSAT interactions for issue resolution, performance tracking, and continuous improvement
  • Support NPI and technology transfers with equipment, materials, and process alignment
  • Conduct root cause analysis and implement corrective actions for process de...

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