Semicon Plating Process Engineer

Job Responsibilities

• Lead the development and optimization of Solder Plating and Nickel Plating processes in collaboration with the R&D team.
• Establish and sustain high-volume manufacturing capabilities for solder and nickel plating processes.
• Develop and qualify new process recipes for each new device.
• Perform process characterization including bump dimensions, bump shear strength, and void analysis.
• Monitor and control process parameters such as bath concentration, lifespan, condition (Solder/Nickel/Cu), plating uniformity, and overall plating quality.
• Serve as backup support for Cu plating processes (IPD and RDL), including new device characterization and chemical bath monitoring.
• Collaborate with the Solder Reflow Engineer to develop and optimize flux coating and solder reflow processes for plated solder bumps.
• Create new recipes for ...