Job Description

Job Description

We are seeking a highly motivated Scientist to join our research team in the field of heterogeneous integration and advanced packaging in the Flat Optics Department under Semiconductor Flagship Initiative. The scientist will develop cutting‑edge D2W (die‑to‑wafer) bonding processes for advanced optoelectronic devices including metasurfaces.

Key Responsibilities
  • Develop die‑to‑wafer bonding processes (surface preparation, plasma activation, high‑accuracy placement).
  • D2W, W2W bonding of optical structures with cameras and micro‑LED displays.
  • Electrical testing of devices, and optimization of process to improve yield and alignment precision.
  • Work with equipment and material team to develop bonding methods.
  • Contribute to intellectual property generation through invention disclosures and patent applications.
  • Support translational research and collaborations with industry partners.
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