RF Engineering Team Lead

About Mistral:

High-Density Interconnect PCBs have a higher wiring density per unit area than conventional PCB and are utilized in complex small form factor designs. This advancement in PCB design is being driven by the miniaturization of components and semiconductor packages that supports advanced features that are getting utilized in revolutionary new products like wearable electronics, touch screen computing, compact, small footprint gadgets, defense, and aerospace applications.

Mistral’s expert team has extensive experience in offering High-Density Interconnect PCB designs including microvias, blind and buried vias, fine lines, and spaces, sequential lamination, via-in-pad technology-based techniques.

Why Mistral?

1. Core Technology Company

2. Flexibility to Work Across Domains

3. Great Learning Opportunity on newer Technologies

4. Flexibility to learn…Freedom to ex...