Job Description

Education:

BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field


Work Experience:


  • At least 8 years of direct or managed IC packaging engineering experience including advanced pkg development (WLCSP, stacked die, laminate and lead frame packages)
  • Prior exposure and work in a high-volume IC assembly production/factory is preferred


Preferred Skills:


  • CAD software use (e.g. AutoCAD and Cadence APD)
  • FEA modeling experience for thermal, mechanical and electrical package optimization
  • Advanced package development knowledge including WLCSP, Cu pillar bump, SiP packaging, and Cu Clip assembly
  • Experience in strip testable package development


RESPONSIBILITIES:


  • Identify suitable Panel Level and WLCSP (PLP) package options an...

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