Quantum Backend Process Engineer (Die Packaging)

A leading quantum computing company is seeking a Backend Process Development Engineer in Espoo, Finland. This role involves developing and optimizing backend processes for quantum processor units, with a strong emphasis on cleanroom operations and collaboration with diverse teams. Candidates should have proven experience in solder reflow processes, die package design for extreme environments, and at least three years in cleanroom operations. The role offers a creative start-up atmosphere with opportunities to contribute to groundbreaking quantum technology.
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