Job Description
Responsibilities
- Coordinate hardware, software, and process projects to improve Die Bonder performance, cost, and functionality.
- Manage projects and sub-projects following established development processes, applying best practices, risk management, and relevant industry standards.
- Plan, track, and report on targets, risks, milestones, costs, and resources; lead review meetings.
- Ensure effective communication within the project team, with project owners, external participants, and production sites.
- Act as sub-project manager, coordinating across R&D sites and supporting series introductions from other sites.
Requirements
- Bachelor's degree in Mechatronics, Electrical, Automation, or a related field.
- At least 2 years' semiconductor back-end and project management experience.
- Strong presentation and communication skills.
Interested applicants for the above advertised position(s)...
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