Job Description

QUALIFICATIONS

  • College graduate or completed at least a 2-year technical course
  • With manufacturing experience in wafer slicing, grinding and planarization technology is an advantage.
  • Knowledgeable in data analysis, Statistical Process Control (SPC), and Failure Mode and Effects Analysis (FMEA)
  • Excellent verbal and written communication skills
  • Must be flexible to the demands of shifting schedule

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