Job Description
ESSENTIAL DUTIES AND RESPONSIBILITIES:
- Responsible for the Underfill (UF) process for flip-chip die-level assembly.
Support Assembly Process Engineering in delivering process and equipment solutions that meet quality, development, and operational requirements.
Maintain assembly yield and assembly test yield related to the Underfill process in line with department targets and KPIs, including lot bracketing and disposition.
Set up new Underfill processes, materials, and recipes, including process window studies, DOE execution, and corner limit evaluations.
Establish golden recipes for new package qualifications.
Maintain Underfill recipe templates according to Positrol log guidelines.
Lead process qualifications to achieve CTQ requirements, CPK targets, risk assessment requirements, UPH, yield, and cost objectives.
Lead new product q...
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