Job Description

Job Qualifications:

  • Graduate of any Engineering course
  • With at least 2 years in FOL Process
  • With at least 2 years in EOL Process

Knowledgeable in:

  • Front of Line Process: Wirebond, Die Attach, Die Prep;
  • End of Line Process: Mold, DTFS, Laser Mark, Final Test, FVI; SMT or Top Level Assembly Process

Job Type: Full-time

Pay: Php35, Php45,000.00 per month

Benefits:

  • Company Christmas gift
  • Company events
  • Health insurance
  • Life insurance
  • Opportunities for promotion
  • Paid training
  • Pay raise
  • Promotion to permanent employee
  • Staff meals provided
  • Transportation service provided

Experience:

  • EOL Process: 2 years (Required)
  • Die Prep: 2 years (Required)
  • Semicon Company: 2 years (Preferred)
  • FOL Process: 2 years (Required)

Work Location: In person

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