Job Description

  • Graduate of Engineering Course (ECE/ME/CPE)
  • At least 2 years minimum as Process Engineer in any Semicon and Electronics Manufacturing
  • Have skills and experience in Wafer Saw, Die Attach and SMT Processing in manufacturing.
  • Have experience in components attach process and oven reflow curing process.

Job Types: Full-time, Permanent

Work Location: In person

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