Job Description
Develop or optimize Die Attach and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.
Participate and support FOL processes tehcnology roadmap and building block activities.
Equipment selection which meet project cost, quality and timeline target.
Share and transfer technical know how within R&D and to Manufacturing team.
Provide technical guidance or job coaching to junior supporting staff.
Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.
Requirement
- Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
- 2-3 years in semiconductor field.
- 2-3 years in Die Attach and Wire Bond processes.
- Process egnineering knowledge in semiconductors or LED manufacturing processes.
- Knowledge in process development step and statistic.
- Minitab knowledge will...
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