Principal Tech Development Engineer - Integrated Heat Spreader Attach Engineer

Principal Tech Development Engineer - Integrated Heat Spreader Attach Engineer

About FusionAP FusionAP is a Malaysia-based startup advanced packaging company focused on delivering innovative 2.5D, 3D, and next‑generation packaging solutions. Through engineering excellence and strategic partnerships, FusionAP enables cutting‑edge technologies for AI, high‑performance computing (HPC) to co‑packaged optic, and other advanced semiconductor applications. We are building a world‑class engineering team to develop and industrialize advanced packaging technologies that power the future of computing and are looking for like minded vibrant individuals to be part of the journey.

Principal Technology Development Engineer – Integrated Heat Spreader Attach Engineer

Senior Level | 10+ Years Experience | FCBGA Assembly, Die-to-Wafer 2.5D Packaging

The exponential growth of high‑performance computing (HPC), artificial intelligence (AI), and...