Job Description

Our international client is currently searching for a Principal Packaging Engineer to support all the business groups with SiC power packaging expertise. The role will involve leading the functionality and performance of SiC products and interfacing with the global package and assembly development community. An important part of the role will be supporting customer interaction, market trends and bench-marking for the company road maps.

Required skills for the Principal Packaging Engineer will include:

  • Extensive knowledge of semiconductor packages, assembly materials and assembly processes
  • Strong SiC or GaN packaging knowledge
  • Excellent communication skills and team player within global, intercultural environment
  • University degree in Physics, Materials Technology, Electronics Engineering or similar

    • Please contact Rachel Anderson for further details.

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