Job Description

Job Description

  • Design high-current, high-density power modules for CPU/GPU/xPU core power and AI server power delivery applications.
  • Collaborate with package engineers and IC designers to develop advanced packaging solutions that integrate ICs, inductors, and capacitors into a high-density module.
  • Conduct PDN extraction for the module package to assess power path losses and switch-node ringing.
  • Design inductors per module and silicon pinmap. Work with inductor vendors to bring concept designs into real products.  
  • Build and run module thermal models to ensure all components remain below maximum operating temperatures.
  • Work with the validation team to debug power modules and perform bench characterization, including efficiency, thermal, and transient performance.
  • Support design-for-manufacturing (DFM) and design-for-test (DFT) activities.

Qualifications

  • BSEE or MSEE with 5+ years of hand...

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