Job Description

A leading memory solutions company seeks an experienced engineer to lead their Die Attach Process Module, focusing on technology development and global collaboration. The ideal candidate will have a Master's or PhD in relevant fields and over 10 years of hands-on experience in semiconductor packaging. This role involves driving product and process innovations and ensuring quality in advanced manufacturing environments. The company prioritizes diversity and offers opportunities for all applicants.
#J-18808-Ljbffr

Ready to Apply?

Take the next step in your AI career. Submit your application to Sandisk today.

Submit Application