Job Description
**Job Details:**
**Job Description:**
Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division focused on next-generation semiconductor packaging solutions.
Primary Focus:
+ Advanced semiconductor packaging technologies beyond traditional methods
+ 3D packaging solutions and chiplet integration
+ High-performance computing packaging for data centers and AI
+ Heterogeneous integration of different chip technologies
+ Scaling packaging density while improving thermal and electrical performance
Key Objectives:
+ Enable Moore's Law continuation through advanced packaging
+ Reduce system-level power consumption and improve performance
+ Support Intel's IDM 2.0 strategy and foundry services
+ Develop packaging solutions for emerging workloads (AI, edge computing)
Packaging Module Equipment Development Engineer responsibilities include but are not limited to:
+ Develops ...
**Job Description:**
Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division focused on next-generation semiconductor packaging solutions.
Primary Focus:
+ Advanced semiconductor packaging technologies beyond traditional methods
+ 3D packaging solutions and chiplet integration
+ High-performance computing packaging for data centers and AI
+ Heterogeneous integration of different chip technologies
+ Scaling packaging density while improving thermal and electrical performance
Key Objectives:
+ Enable Moore's Law continuation through advanced packaging
+ Reduce system-level power consumption and improve performance
+ Support Intel's IDM 2.0 strategy and foundry services
+ Develop packaging solutions for emerging workloads (AI, edge computing)
Packaging Module Equipment Development Engineer responsibilities include but are not limited to:
+ Develops ...
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