Job Description
**Job Details:**
**Job Description:**
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
As a **Packaging Module Development Engineer** , you will.
+ Contribute to the advancement of technology and foundry capabilities by developing First‑Level and Second‑Level Interconnect (FLI/SLI) and thermal solutions to support Intel’s future packaging platforms.
+ Collaborate with multifunctional, cross‑organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
+ Drive innovation in next‑generation equipment, materials, and fabrication processes to ...
**Job Description:**
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
As a **Packaging Module Development Engineer** , you will.
+ Contribute to the advancement of technology and foundry capabilities by developing First‑Level and Second‑Level Interconnect (FLI/SLI) and thermal solutions to support Intel’s future packaging platforms.
+ Collaborate with multifunctional, cross‑organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
+ Drive innovation in next‑generation equipment, materials, and fabrication processes to ...
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