Packaging Module Development Engineer

Overview

Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization. CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process. Candidate will focus on Process and Technology Development for Electronic packaging assembly process on New Product and Test Vehicle.

Responsibilities

• Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Conducts fundamental studies and performs experiments to characterize materials, processes, identify potential failure modes, understand performance interactions, optimize, assess feasibility of technology use on product, and make technol...