Packaging Module Development Engineer

Job Details:

Job Description: 

Board Assembly Technology Development (BATD), part of Intel's Assembly Technology Development (ATD) packaging team, cater to Intel's customer product assembly needs and certify Surface Mount Technology (SMT) manufacturing for new Central Processing Unit (CPU), Chipset, System on Chip (SoC) BGA packages, and Socket Technology. The Board Assembly Technology Development Lab in Kulim, Malaysia, offers SMT manufacturing, provides expertise in technology development, enabling next-generation product roadmaps through innovative solutions in circuit board technology, assembly processes, and materials.
In this role, you will be a Packaging Module Development Engineer focuses on process and materials technology development for SMT processes and Printed Circuit Boards (PCBs). Your responsibilities will include developing SMT process solutions and recommendations for Intel's integrated circuit (IC) packages and Sockets, as well as adva...