Packaging Module Development Engineer

Job Description

• Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization
• CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process
• Candidate will focus on Process and Technology Development for Electronic packaging assembly process on New Product and Test Vehicle
• Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization
• Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
• Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Optimizes and improves the efficiency of manufac...