Job Description

The Emerging Packaging and Test Team at Texas Instruments is looking for a qualified candidate

+ To lead a high-performing team of packaging technologists to define, design, develop and scale to volume production high voltage (200-3300V) packages and high power modules for the Industrial, Automotive, Renewable and Telecom markets.
+ The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps
+ The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools.
+ The candidate will identify prototype/subcon partners, assess manufacturing capabilities and drive completion of 1 st article builds. The candidate must also be capable of developing new process flows/technologies necessary for scaling to high volume manufactur...

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