Operator (Wirebond)

Job Description
Empowering high‑precision semiconductor production through skilled operation of back‑end assembly equipment.

Responsibilities

• Perform specific back-end semiconductor manufacturing functions in the production of semiconductor devices
• Operate various equipment in performing functions such as wafer scribe and break, die sort, die attach, lead bonding and seal, test, or mark and pack.

Qualifications
Graduate of a 2-year Technical course or Senior High School, or completed at least 2 years in college

About Us
onsemi
(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power...