MODULE LEAD - LEAD

Key Responsibilities

�       Design and develop PCB layouts.

�       Work on high speed, multi layer PCB designs including stack up definition.

�       Perform differential pair routing, impedance control, matched delay routing, and signal integrity best practices.

�       Create, validate, and maintain PCB footprints, symbols, and libraries.

�       Ensure designs comply with IPC, UL, and MIL standards.

�       Apply EMI/EMC design guidelines and support design reviews.

Mandatory Skills

�       6+ years of experience in PCB design and development.

�       Experience with Allegro or Altium.

�       Expertise in high speed and multilayer PCB layout.

�       Experience in Multi layer stack up design, Length matching and matched delay routing, Strong knowledge of surface mount and through hole components, understanding of IPC standards, including: IPC 2221A, IPC SM 782, IPC 7351, UL and MIL standards.

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